Tin

Tin (Sn) is one of the four 3TG conflict minerals, extracted from cassiterite ore. Tin is used primarily as a solder in electronics manufacturing (circuit boards, component assembly), in tin plating, and in alloys. Tin is the highest-volume 3TG mineral used in electronics. Significant sources of tin include the DRC, Indonesia, and Myanmar. The DRC is a notable conflict-risk source, particularly from eastern provinces. Tin smelters are audited under RMAP for responsible sourcing.

Dodd-Frank Act Section 1502; Form SD Item 1.01(d)(3); Regulation (EU) 2017/821, Annex I.

Tin is present in virtually every electronic product as solder, making it one of the most widely reported conflict minerals. Companies manufacturing or purchasing electronic assemblies should ensure all tin smelters in their supply chain are identified through CMRT collection and verified against the RMAP conformant list. Many large tin smelters are based in Indonesia (PT Timah, Minsur) and are RMAP conformant, but DRC-sourced tin requires additional supply chain scrutiny.

A medical device manufacturer reviews its CMRT data and identifies 12 tin smelters across its PCB supplier network. 11 are RMAP conformant. 1 is Indonesian-based and listed as active (audit in progress). The manufacturer notes this in its Conflict Minerals Report and monitors the active smelter for progression to conformant status at the next audit cycle.